High Temp SMD Grounding Contacts
Metallized Film-over-Silicone Foam
SMD METALLIZED FILM-OVER-SILICONE FOAM GROUNDING CONTACT Laird’s High Temperature SMD (Surface Mount Device) Grounding Contact is a Silicone foam cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder reflow compatible, and are suitable for automatic processing.
SNC45RXP is a Nickel/ Graphite filled silicone paste with very low hardness which contributes to relatively low compression force when it is used as dispensed gaskets in between of chassis and cover. It is also designed to be used under high compression rate up to 60% so that the gaskets can compensate large tolerance of substrates. It also has good shielding performance with balanced mechanical properties. This grade end in a very cost effective FIP solution through its low density and fast dispensing speed.
Ferrite Based Dual Inductors MCD1010 Series
- Surface mount device
Micro BLS - Two-piece extra low profile BLS
Enabling smaller and thinner electronic devices while maintaining the benefits of part rigidity and repairability Standard rigid corner board level shielding designs get crowded with assembly height below 2.0 mm. Latching features on the drawn step will eliminate the need for a separate hole on the side wall. Micro BLS uses the spring properties of stainless steel cover to snap into the top surface of the frame instead of side wall. Contact dimple on the side walls improve the shielding effectiveness. Pinch to install covers creates a secure attachment to frame.
Low DCR & High Current Power Inductors
Ferrite Plate for Resonant Wireless Charging
Wireless Charging Receiver Module for 15 Watts Medium Power
Litz Coil Version
Broadband Wire Wound power Common Mode Choke
High Current SMD Power Bead
Wireless Charging Receiver Module For 15 Watts Medium Power
High Temperature, Magnetically Loaded Thermoplastic Absorber
Performance Thermal Gap Filler
Laird Tflex™ HD700 Is our latest product in our High Deflection series. Tflex™ HD700 combines a 5 W/mK with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. The result will be higher mean time before failure (MFBF) of your device as less mechanical and thermal stresses will be experienced.
Tflex™ HD700 is available in thickness from 0.5mm (0.020”) to 5mm (0.200”). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.
Tflex™ CR200 Series
Gap Filler MaterialTWO-PART CURE IN PLACE GAP FILLER
Tflex™ CR200 is a two-part, silicone-based thermal gap filler that has low viscosity prior to curing. Tflex™ CR200 is ideal for applications where large gap tolerances are present. The low viscosity makes it ideal for applications in which the components cannot withstand high pressure during assembly. The mixed material will cure at room temperature or can be accelerated with the addition of heat. The Tflex™ CR200 composition provides excellent thermal performance and compliance. The Tflex™ CR200FC will provide similar thermal and mechanical characteristics as the market known Tflex™ CR200, but with a faster curing profile (see table below).
0.5mm and 0.75mm High Deflection Thermal Gap Filler
Laird Tflex HD400 is a 4.0 W/mK gap filling material in our high deflection line of products. Tflex HD400 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex HD400 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, filler and resin knowledge result in this advanced product designed with customer applications in mind.
Tflex HD400 is provided in thickness from 0.5mm (.020”) and .75mm (.030”). For thicknesses greater than 0.75mm (0.030”) please review datasheet for HD400 (1mm (.040”) to 5mm (.200”). Please contact Laird for information and pricing. In addition, Laird can provide Tflex HD400 in multiple converted formats through approved converters and distribution networks. Also, if your application requires, we can deliver sheets of material as large as 230mm (9”) X 230mm (9”).
Thermally Conductive Insulator (Preliminary)HIGH PERFORMANCE THERMAL INTERFACE PRODUCTS
Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron nitrate composite. It is specially designed to maximize high thermal and electrical isolation performance for wide variety of applications.
The unique formulation offers an excellent smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces. Tgard™ 100 is ideal for applications that require low component mounting forces include discrete semiconductors mounted with clips.